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3»ó: 240[KA]~960[KA] LP, TNC |
3»ó: 30[KA]~100[KA] |
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Áß¼º¼±(N)°ú Á¢Áö(G) µî ÀüÀ§ îêùê N-G°£ ÀüÀ§Â÷ : <0.82[mV] |
Áß¼º¼±(N)°ú Á¢Áö(G) µîÀüÀ§ ÝÕʦ N-G°£ Àü±âÀû Á¢¼Ó ÝÕʦ/5.84 [V] |
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ÀûÇÕ ÆÇÁ¤/MIL-STD-810G:2008 Method 514.6
(Table 514.6C-VI) À̵¿Çü ·¹ÀÌ´õÂ÷·®(Çرº), ÀüÆÄ°¨½Ã Â÷·®¿ë (À°±º)À¸·Î ³³Ç° |
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EMI, EMC |
ÀûÇÕ ÆÇÁ¤/IEC 61000-6-1, IEC 61000-6-3 ±º¿ë(Àü·«)¹°ÀÚ µî·Ï/À̵¿Çü ·¹ÀÌ´õ Â÷·® |
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±¹°¡Àç°í¹øÈ£(NSN): 5920-37-530-4675 |
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RDECOM: U.S. Army Research, Development and Engineering Command. US Army Foreign Technology Database, ¹Ì À°±º Çؿܱâ¼ú Àåºñ ¸ñ·Ï GSTW µî·Ï: Global Science and Technology Watch (ID of GSTW for 'eca3G': 2,200) |
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